View BGB719N7ESD_8963169.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

rf & protection devices data sheet revision 1.1, 2012-10-30 BGB719N7ESD low noise amplifier mmic for fm radio applications
edition 2012-10-30 published by infineon technologies ag 81726 munich, germany ? 2013 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGB719N7ESD data sheet 3 revision 1.1, 2012-10-30 trademarks of infineon technologies ag aurix?, c166?, canpak?, ci pos?, cipurse?, econopac k?, coolmos?, coolset?, corecontrol?, crossav e?, dave?, di-pol?, easypim?, econobridge?, econodual?, econopim?, econopack?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, optimos?, origa?, powercode?; primarion?, pr imepack?, primestack?, pr o-sil?, profet?, rasic?, reversave?, satric?, si eget?, sindrion?, sipmos?, smartl ewis?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mipi? of mipi allianc e, inc. mips? of mips technologies, inc., u sa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of si rius satellite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektro nix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilo g?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorpor ated. vxworks?, wind river? of wind ri ver systems, inc. zetex? of diodes zetex limited. last trademarks update 2011-11-11 BGB719N7ESD, low noise amplifier mmic for fm radio applications revision history: 2012-10-30, revision 1.1 page subjects (changes since previous revision) this data sheet replaces the revision from 2011-10-10. the product itself has not been changed and the device characteristics remain unchanged. only the product description and information available in the data sheet have been expanded and updated.
BGB719N7ESD table of contents data sheet 4 revision 1.1, 2012-10-30 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 product brief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 operation conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.1.1 typical dc characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.2 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.2.1 typical ac characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 package information tsnp-7-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table of contents
BGB719N7ESD list of figures data sheet 5 revision 1.1, 2012-10-30 figure 3-1 pinning of BGB719N7ESD in tsnp-7-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 4-1 functional block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 4-2 application board drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6-1 total power dissipation p tot = f ( t s ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 8-1 i cc as a function of v cc , v ctrl = 3 v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 8-2 input and output matching curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 8-3 i cc as a function of t a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 9-1 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 9-2 package footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 9-3 marking description (marking BGB719N7ESD: ac) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 9-4 tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 list of figures
BGB719N7ESD list of tables data sheet 6 revision 1.1, 2012-10-30 table 3-1 pinning table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 4-1 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 5-1 maximum ratings at t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 5-2 esd robustness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 6-1 thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 7-1 operation conditions at t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 8-1 dc characteristics at t a = 25 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 8-2 ac characteristics in the fm radio lna application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 list of tables
BGB719N7ESD product brief data sheet 7 revision 1.1, 2012-10-30 1 product brief so-called active antenna modules containing a unique passive structure tailored for fm radio and directly interfaced to appropriate amplifier circuitry are rapidl y gaining market acceptance in emerging mobile device applications. high gain, low noise amp lifiers with small footprints and high robustness against electrostatic discharge are key components for thes e active antenna designs. the bgb7 19n7esd fulfills all the necessary criteria for such active antennas and is able to solve t he main problems in embedded active fm antenna designs for handset devices enhancing the receiver sensitiv ity and consuming less power and less board space. the device is based on infineon tec hnologies? cost effective silicon germanium (sige:c) technology and comes in a small leadless green package with visible lead s enabling optical inspecti on of soldering quality.
BGB719N7ESD features data sheet 8 revision 1.1, 2012-10-30 2 features applications ? low noise amplifier and active matching for fm reception with small antennas in all kinds of mobile devices such as cell phones, pdas, portable fm radio, mp3 players ? low noise amplifier at 13.56 mhz for ne ar field communication (nfc) applications attention: esd (electrostatic discharge) sensitive device, observe handling precautions ? high performance fm radio lna with integrated biasing ? frequency range: 10 mhz to 1 ghz ? low external parts count ? super miniature low profile leadless package tsnp-7-6, 1.26 x 1.4 x 0.37 mm ? high gain at only 2.8 ma current consumption ? integrated active biasing circui t enables stable operating point against temperature-, supply voltage- and processing-variations ? integrated esd protection for all pins (1.5 kv, hbm) ? high input compression point ? high input impedance ? excellent noise figure from latest sige:c technology ? supply voltage: 1.5 v to 4.0 v ? power-off function ? pb-free (rohs compliant) and halogen-free package ? qualification report according to aec-q101 available product name package marking BGB719N7ESD tsnp-7-6 ac
BGB719N7ESD pin configuration data sheet 9 revision 1.1, 2012-10-30 3 pin configuration figure 3-1 pinning of BGB719N7ESD in tsnp-7-6 table 3-1 pinning table pin name function 1 v ctrl on/off control voltage 2 rf in rf input 3 gnd rf rf gnd 4 nc not connected 5 rf out rf output 6 v cc supply voltage 7 gnd dc dc gnd tsnp-7-6 2 3 6 5 4 7 1
BGB719N7ESD functional block diagram data sheet 10 revision 1.1, 2012-10-30 4 functional block diagram the functional block in figure 4-1 shows the principal schematic how the BGB719N7ESD is used in a circuit. the power on/off function is controlled by applying v ctrl . base- and collector voltages are applied internally. figure 4-1 functional block diagram figure 4-2 application board drawing table 4-1 bill of materials component value manufacturer / type function c in 330 pf various / 0402 dc blocking c out 330 pf various / 0402 dc blocking c byp 47 nf various / 0402 bypass capacitor rf in rf out v cc v ctrl nc 7 (on package backside) c in c out out dc, v ctrl in 1 2 34 5 6 gnd dc gnd rf BGB719N7ESD bias circuit lna BGB719N7ESD function block dc, v cc c byp
BGB719N7ESD maximum ratings data sheet 11 revision 1.1, 2012-10-30 5 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. table 5-1 maximum ratings at t a = 25 c parameter symbol values unit note / test condition min. typ. max. supply voltage v cc ??4.0v? supply current at v cc pin i cc ??25ma? dc current at rf in pin i b ??3ma? on/off control voltage v ctrl ?? v cc v? total power dissipation 1) 1) t s is the soldering point temperature. t s is measured at the gnd pin (7) at the soldering point to the pcb p tot ??100mw t s 112 c junction temperature t j ??150c? storage temperature t stg -55 ? 150 c ? table 5-2 esd robustness testing model standard value unit human body model jesd22-a114-b 1500 v
BGB719N7ESD thermal characteristics data sheet 12 revision 1.1, 2012-10-30 6 thermal characteristics figure 6-1 total power dissipation p tot = f ( t s ) 7 operation conditions table 6-1 thermal resistance parameter symbol values unit note / test condition min. typ. max. junction - soldering point 1) 1)for the definition of r thjs please refer to application note an077 (thermal resistance calculation) r thjs ?375?k/w table 7-1 operation conditions at t a = 25 c parameter symbol values unit note / test condition min. typ. max. supply voltage v cc 1.53.04.0v? voltage ctrl on/off pin in on mode v ctrl-on 1.2 3.0 v cc v? voltage ctrl on/off pin in off mode v ctrl-off -0.3 0 0.3 v ? 0 20 40 60 80 100 120 0 50 100 150 ts [c] ptot [mw]
BGB719N7ESD electrical characteristics data sheet 13 revision 1.1, 2012-10-30 8 electrical characteristics 8.1 dc characteristics 8.1.1 typical dc ch aracteristic curves the measurement setup is an application circuit according to figure 4-1 . t a = 25 c figure 8-1 i cc as a function of v cc , v ctrl = 3 v table 8-1 dc characteristics at t a = 25 c parameter symbol values unit note / test condition min. typ. max. supply current i cc 2.32.83.3ma v cc = 3 v v ctrl = 3 v small signal operation supply current in off mode i cc-off ?16a v cc = 4.0 v v ctrl = 0 v current into ctrl on/off pin in on mode i ctrl-on ?69a v cc = 3 v v ctrl = 3 v current into ctrl on/off pin in off mode i ctrl-off ??0.3a v cc = 4.0 v v ctrl = 0 v
BGB719N7ESD electrical characteristics data sheet 14 revision 1.1, 2012-10-30 8.2 ac characteristics 8.2.1 typical ac ch aracteristic curves the measurement setup is an application circuit according to figure 4-1 . t a = 25 c figure 8-2 input and output matching curves table 8-2 ac characteristics in the fm radio lna application 1) 1) as described in an255, t a = 25 c, v cc = 3 v, v ctrl = 3 v, f = 100 mhz parameter symbol values unit note / test condition min. typ. max. insertion power gain | s 21 | 2 13.5 db ? input return loss 2) 2) verified by random sampling rl in ?0.5 3) 3) high lna input impedance leads to power matching with high ohmic antennas ?db? output return loss 2) rl out ?11?db? noise figure 4) 4) a low pass filter prevents radio broadcas t signals from distorting the nf measurement nf 50 ?1.2?db z s = 50 ? input 1db gain compression point 2) ip -1db ?-6?dbm? input 3rd order intercept point 2) iip 3 ?-14?dbm p rfin = -30 dbm
BGB719N7ESD electrical characteristics data sheet 15 revision 1.1, 2012-10-30 figure 8-3 i cc as a function of t a
BGB719N7ESD package information tsnp-7-6 data sheet 16 revision 1.1, 2012-10-30 9 package information tsnp-7-6 figure 9-1 package outline figure 9-2 package footprint figure 9-3 marking descriptio n (marking BGB719N7ESD: ac) figure 9-4 tape dimensions 0.05 1.26 0.5 0.05 0.05 1.16 0.05 0.05 1) 6 x 0.2 0.05 1.4 0.05 1) 1) 0.375 0.02 max. +0.025 -0.015 tsnp-7-6-po v01 1 2 3 7 5 46 pin 1 marking 1) dimension applies to plated terminals 0.96 1.175 top view bottom view 6 x 0.225 0.05 1) smd stencil apertures copper solder mask vias 1.21 0.51 0.35 0.45 0.2 0.25 0.25 0.23 0.23 0.25 0.25 0.25 0.23 0.23 0.25 0.2 0.35 1.21 0.51 1.55 0.35 0.45 0.2 0.2 0.35 1.55 tsnp-7-6-fp v01 1.6 4 8 1.7 0.5 pin 1 marking tsnp-7-6-tp v03
published by infineon technologies ag www.infineon.com

▲Up To Search▲

Price & Availability of BGB719N7ESD

	To Download BGB719N7ESD Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .